Before selecting thermal conductive silicone sheets, factors to consider include electronic product structure, thermal conductivity, scale, thickness, thermal resistance, and expected effects.

Precautions for selecting thermal conductive silicone material:

1. Product structure design selection: In the early stage of electronic product structure design, thermal conductive silicon film should be considered to be integrated into the design problem. In different requirements and usage environments, the heat dissipation scheme is different. The optimal heat dissipation scheme should be selected based on actual situations, and a reasonable heat dissipation structure should be designed to maximize the effect of thermal conductive silicon film.

Thermal conductive silicone sheet
2. The selection of thermal conductivity coefficient for thermal conductive silicon film depends on both the expected effect and the power consumption of the heat source, as well as the amount of heat that can be dissipated by the design of the heat sink or cooling structure. Select the thermal conductivity of thermal conductive silicon film based on these requirements. Low thermal conductivity results in lower costs, while high thermal conductivity results in better results and higher costs.

3. The selection of the thickness of the thermal conductive silicone film should take into account the heat dissipation scheme used in the electronic product itself. If choosing a type of heat dissipation structure, it is necessary to consider the shape and structure of the heat dissipation structure on the contact surface, and strike a balance between the design structure and the thickness selection of the thermal conductive silicone film. The selection of thickness is also related to parameters such as hardness, density, and compression ratio of the product.

4. The best way to choose the size of thermal conductive silicon film is to cover the heat source. The breakdown voltage, resistance, surface resistivity, etc. meet the conditions.