What is the difference between thermal grease and thermal silica?
Thermal silica
Thermal silica gel is a heat-conducting RTV adhesive. It can be cured at room temperature. The biggest difference between thermal conductivity and thermal grease is that thermal silica gel can be cured and has certain bonding properties.
Thermal film
There is a material in the industry called thermal film, which is generally used for some electronic parts and chip surfaces that generate less heat. This material has a relatively small thermal conductivity and generally low thermal conductivity.
In addition, thermal grease is one of materials used to fill the gap between the CPU and the heat sink. Its function is to transfer the heat radiated by the CPU to the heat sink, keep the CPU temperature at a level that can work stably, prevent the CPU from being damaged due to poor heat dissipation, and prolong the service life.
In heat and heat transfer applications, even if the two surfaces with very smooth surfaces come into contact with each other, voids appear. The air in these gaps is a poor conductor of heat, which hinders the conduction of heat to the heat sink. Thermal grease is a material that fills these gaps and makes heat transfer smoother and faster.
There are many types of silicone greases on the market today, and different parameters and physical properties determine different uses. For example, some are suitable for CPU heat conduction, some are suitable for memory heat conduction, and some are suitable for power supply heat conduction... There are also some electronic products, power supply cooling, sensor rapid temperature measurement, etc. can be used.
The working temperature of the thermal grease is generally not more than 200 ° C, the high temperature is up to 300 ° C, and the low temperature is generally about -60 ° C.
Thermal grease is a high thermal conductivity insulating silicone material that hardly cures forever. It can be used for a long time at a temperature of -50 ° C to +230 ° C. It has excellent electrical insulation and excellent thermal conductivity, and has low oil dispersion (to zero), high and low temperature resistance, water resistance, ozone and weathering resistance. It can be widely applied to various electronic products, the contact surface between the heating body (power tube, thyristor, electric heating stack, etc.) and the heat dissipation device (heat sink, heat sink, housing, etc.) in the electrical equipment. Heat transfer media and moisture, dust, corrosion, shock and other properties. It is suitable for surface coating or integral potting of various microwave devices such as microwave communication, microwave transmission equipment, microwave dedicated power supply, and regulated power supply. This kind of silicon material provides excellent thermal conductivity for generating hot electronic components. Such as: transistors, CPU assembly, thermistor, temperature sensor, automotive electronic components, car refrigerators, power modules, printer heads, etc.