After the manufacturing of electronic products is completed, it is often necessary to undergo another sealing process to isolate them from the outside world, in order to improve the seismic resistance and waterproof performance of electronic products, prevent electronic components from being eroded by the natural environment, and extend the service life of electronic products. At present, there are various sealing materials used for pouring in electronic components, mainly polyurethane, epoxy resin, and silicone materials. The most commonly used among them is silicone based potting adhesive, which is widely used due to its various excellent properties.
Organic silicon polymer materials have unique weather resistance, aging resistance, excellent high and low temperature resistance, good hydrophobic mechanical properties, electrical insulation, etc. due to their special silicon oxygen bond main chain structure, and are widely used for encapsulation protection of electronic and electrical components.
The characteristics of organic silicon:
1) It has excellent resistance to high and low temperatures, and the cured organic silicon sealing adhesive maintains elasticity even when subjected to cold and hot impacts between -60 β and 200 β.
2) During curing, it does not absorb or release heat, and does not shrink after curing. It will not have any impact on electronic components and has good bonding performance.
3) Has excellent electrical and insulation properties, and has no corrosiveness to materials.
4) Strong thermal conductivity, effectively improving the heat dissipation ability of electronic products.
5) It can be cured at room temperature or at elevated temperature, making it easy to operate. The common two component addition formed silicone rubber sealing adhesive is composed of vinyl terminated silicone oil as the base adhesive, hydrogen containing silicone oil as the crosslinking agent, and aluminum oxide (AI2O3) as the thermal conductive filler. Methacryloxypropyltrimethoxysilane (KH570) can be added as a coupling agent, and platinum catalyst (PL-2600) can be used as a catalyst. Organosilicon gel material has become an indispensable sealing material in the field of electronic devices (such as LED display screen, IGBT packaging, etc.) because of its excellent temperature resistance, waterproof, electrical insulation performance, colorless and transparent, not easy to yellowing and other characteristics.
Vinyl silicone oil,pls check
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