With the vigorous development of the electronic industry, people pay more attention to the stability of products, and have more stringent requirements for the weather resistance of electronic products, so now more and more electronic products need to be potted, and the potted electronic products can enhance their performance. Waterproof ability, shock resistance and heat dissipation performance, protect electronic products from the erosion of natural environment and prolong their service life.

For the potting of electronic products, silicone-based potting compounds are generally used because they have good high and low temperature resistance, and can withstand cold and heat changes between -60°C and 200°C without cracking and maintaining elasticity. The material has good thermal conductivity after filling and modification. After potting, it can effectively improve the heat dissipation capacity and moisture-proof performance of electronic components, and the electronic potting compound made of silicone is soft after curing, which is convenient for the maintenance of electronic equipment. , Compared with the electronic potting glue made of epoxy resin, the hardness after potting and curing is high, it is easy to strain the electronic components, and the resistance to cold and heat changes is poor. The temperature is only -10 ℃ ~ 120 ℃, which is generally only suitable for electronic equipment without special requirements for the environment.

However, silicone potting compounds also have two disadvantages:

1. The adhesion is poor. When used as a potting and coating material, in order to improve the adhesion with the basic substrate, it is usually necessary to pre-coat the substrate or add a tackifier, which is troublesome to use. .

2. It is easy to be poisoned (not cured). Silicone potting glue is a relatively environmentally friendly potting glue. Platinum curing agent is relatively active, and it is easy to react with other impurities and cause poisoning. This requires strengthening the quality control of the adhesive, improving the anti-toxicity of the colloid, maintaining a stable curing ability, and at the same time having a certain bonding ability.