Silicone encapsulant has good fluidity, simple and convenient operation, and can be used for molding applications such as infusion and injection. After curing, it has excellent electrical, protective, physical, weather resistance and other performance characteristics. In terms of curing methods, there are two types of silicone potting compounds: addition type and condensation type, so what are the differences in application?

1. the depth of curing
After the two components of the addition type potting glue are mixed evenly, the glue is poured, and the curing process is consistent as a whole, that is to say, how thick the glue is, the thicker the overall curing is. Moisture participates in the reaction, curing is carried out from the surface to the interior, and the curing depth is related to moisture and time, so in application, it is generally not suitable for condensation-type potting compounds to fill or encapsulate products with deep or thick thickness.

2. Heating application
Increasing the curing speed of the silicone potting compound can improve the production efficiency, so many users increase the baking process, which greatly speeds up the time of the next process, but this process is only suitable for the use of the addition type silicone potting compound, and the condensation type The curing of the encapsulant requires two key conditions, namely moisture and catalyst, which have no obvious relationship with temperature.

3. Adhesion performance
When the silicone potting compound needs to have certain adhesive properties during the application process, the condensed silicone potting compound is preferred, which has good bonding properties with most materials and will not have edge debonding. Phenomenon, the addition type of silicone is slightly worse.