Liquid silicone rubber has a wide range of applications in the semiconductor industry. The following are some common applications of liquid silicone rubber in semiconductors:

Packaging material: Liquid silicone rubber is commonly used as an adhesive in semiconductor packaging. It can provide excellent sealing performance, protecting chips and electronic components from external environmental influences such as dust, moisture, and chemicals. The high-temperature stability and chemical inertness of liquid silicone rubber make it an ideal packaging material choice.

Thermal conductive material: Liquid silicone rubber has excellent thermal conductivity and can be used as a key component of semiconductor heat dissipation solutions. It can be filled between the heat sink and the chip, providing effective heat conduction, reducing chip temperature, and ensuring the normal operation and lifespan of the device.

Mold and rubber mold manufacturing: Liquid silicone rubber can be used to manufacture molds and rubber molds for semiconductor products. It has high elasticity and wear resistance, and can produce complex mold structures for injection molding, indentation, and bonding processes. These molds can be used to manufacture semiconductor chips, packaging components, and other microelectronic devices.

Electronic component protection: Liquid silicone rubber can be used for the protection and insulation of electronic components. It can be coated on the surface of electronic components, providing a protective layer to prevent moisture, oxidation, and electromagnetic interference. This is crucial for the long-term reliability of key components such as semiconductor chips, sensors, and circuit boards.

It should be noted that the specific application of liquid silicone rubber in the semiconductor industry may vary depending on manufacturing processes, product requirements, and specific application areas. Therefore, in specific applications, it is necessary to select appropriate liquid silicone rubber materials and application methods based on actual needs and process requirements.