Mingyi Silicone(Anhui) Co., Ltd.
General Precipitated Liquid Silicone MY LSR 3525 Series
Two component, low viscosity addition silicone rubber MY LSR 3G30-303
Addition liquid silicone rubber for copper plate printing MY 3M35
RTV two-component silicone thermal conductive silicone rubber MY LSR 3760
Phenyl Liquid Silicone Rubber MY BLSR 3218
Chip silicone rubber MY LSR 3405 A/B is a two-component platinum-catalyzed transparent silicone elastomer. When Components A and B are mixed and cured, they form a flexible, cushioning material with a certain degree of adhesion. This type of liquid silicone rubber has unique physical properties, making it suitable for high-precision electronic potting and filling. Composed of platinum-catalyzed polydimethylsiloxane, it has a curing temperature range of room temperature to 200℃ and produces no by-products.
Resists moisture, contaminants, and other atmospheric components; reduces mechanical stress and tension caused by mechanical impact, thermal shock, and vibration.
Maintains stable mechanical and electrical properties between -50℃ and 200℃; offers self-healing performance.
An ideal choice for protecting sensitive electronic components in extreme environments.
Solvent-free two-component system.
Low viscosity before curing, enabling easy processing.
Excellent flexibility with no stress.
Extremely low oil bleeding and shrinkage after curing.
|
Item |
Component A / Component B |
|
Appearance |
Colorless semi-transparent fluid |
|
Viscosity, mPa·s (25℃) |
40000-60000 / Customizable |
|
Specific Gravity, g/cm³ (25℃) |
0.99-1.03 / 0.99-1.03 |
|
Mixing Ratio (by mass) |
A:B = 1:1 |
|
Viscosity after Mixing, mPa·s (25℃) |
40000-60000 (depending on the ratio) |
|
Working Time after Mixing, min (25℃) |
>3 hours (varies with room temperature, adjustable) |
|
Curing Conditions, ℃/hr |
<25℃/24 hours or 100℃/10 minutes (adjustable) |
|
Item |
Specification |
|
Flame Retardant Rating |
UL94 V-0 |
|
Appearance of Cured Product |
Colorless semi-transparent gel |
|
Operating Temperature Range, ℃ |
-60~200 |
|
Shrinkage Rate, % |
<1.5 |
|
Water Absorption Rate, % |
<1.0 (after long-term immersion) |
|
pH Value |
6—8 |
|
Cleaning Agent (Before Curing) |
n-Hexane, benzene, toluene, xylene |
|
Cleaning Agent (After Curing) |
n-Hexane, benzene, toluene, xylene |
|
Dielectric Constant (1MHz) |
3.2 |
|
Electric Strength, kv/mm |
18 |
|
Volume Resistivity, Ω·cm |
1.0×10¹⁴ |
|
Breakdown Resistivity, MV/m |
≥20 |
|
Hardness |
3-8 Shore A |
Note:
The working time is tested with a glue mixing amount of 100g.
All data for the cured state are measured 7 days after the glue is cured under the conditions of 25℃ and 55% RH.
Weigh Components A and B at a ratio of 1:1, mix them evenly, let the mixture stand for 10 minutes, then inject it into the module. It is recommended to inject slowly along one side to reduce the generation of air bubbles.
Let the potted component stand to allow natural defoaming. After most air bubbles disappear, the component can be cured by heating (at 120℃, approximately 20-40 minutes, depending on the glue layer thickness) or directly cured at room temperature (approximately 6-10 hours).
Vacuum defoaming of the mixed Components A and B can improve product performance.
Seal Components A and B tightly after taking the required amount for storage.
Too low a temperature will slow down the curing speed; heating for curing is recommended.
Contact with materials containing sulfur, amines, or tin will make curing difficult.
Component A: 25KG plastic drum/iron drum; Component B: 25KG plastic drum/iron drum
Component A: 200KG iron drum; Component B: 200KG iron drum
Shelf life: 1 year (at 25℃). Store in a sealed container, away from light and heat.
This product is non-hazardous; transport and store it as a general chemical.
