Encapsulants and potting compound are sealing materials widely used in electronics, electrical appliances, communications, automobiles, and other fields. They are mainly used to fill, seal, fix, and protect various electronic components, thereby improving their moisture resistance, dust resistance, shock resistance, and insulation performance. Encapsulants and potting compound are typically composed of resins, curing agents, fillers, and additives. They are mixed and cured under specific proportions and process conditions to form a sealing layer with excellent performance.

The main characteristics of encapsulants and potting compound include:

1. Excellent sealing performance, capable of completely filling gaps between components and effectively preventing the intrusion of moisture, dust, and other harmful substances.

2. Good insulation performance, with high insulation resistance and breakdown voltage, ensuring the normal operation of electronic components in harsh environments.

3. Strong shock resistance, with good elasticity after curing, effectively absorbing and distributing vibration energy to protect electronic components from damage.

4. Good weather resistance, capable of maintaining stable performance under high temperature, low temperature, humidity, and other harsh environments, thereby extending the service life of electronic components.

Precipitated grade self-lubricating rubber, plz check MY D1330