Recommended Application Field

SMD (Surface Mount Device)

Technical Parameters

Viscosity of Part A (mPa·s at 25℃): 4500

Viscosity of Part B (mPa·s at 25℃): 6000

Mixing Ratio: 1:5

Mixed Viscosity (mPa·s at 25℃): 6000

Curing Conditions: 100℃/1h + 150℃/3h

Refractive Index: 1.54

Hardness (Shore): 52D

Elongation (%): 40

Tensile Strength (MPa): 8

Light Transmittance (%): 92

Moisture Vapor Transmission Rate (g/m²·24h): 5.70

Oxygen Transmission Rate (cm³/m²·24h): 270

Coefficient of Linear Expansion (ppm): 170

Features

Excellent sulfur resistance and heat resistance, suitable for encapsulation of medium-to-high power LEDs.